Story
Nvidia and Amkor Sign $1.5 Billion Deal to Expand US Chip Packaging for AI

Summary
Amkor Technology and Nvidia have entered a multi-year, $1.5 billion agreement to expand advanced semiconductor packaging in the U.S., sending Amkor's shares soaring 17% in after-hours trading.
Amkor Technology and Nvidia have entered into a multi-year, $1.5 billion agreement to significantly expand advanced semiconductor packaging and testing capacity in the United States. The deal, announced Thursday, is a direct response to the surging demand for AI infrastructure and sent Amkor's shares soaring in extended trading.
Partnership to Boost US Capacity
Under the terms of the agreement, Nvidia will make a prepayment to Amkor to help fund the expansion of its U.S. advanced packaging operations, including capacity at its Arizona facilities. Amkor Technology confirmed the details in a statement on Thursday.
The collaboration will focus on the joint development of packaging and testing technologies for Nvidia’s AI and accelerated-computing platforms. This involves sophisticated techniques for combining different types of chips into a single, high-performance package, a critical step in manufacturing the powerful processors that drive artificial intelligence.
Market Impact and Strategic Context
Investors reacted swiftly to the news, with shares of Amkor Technology (AMKR) jumping 17% in after-hours trading. The deal builds upon an existing relationship where Amkor already supplies advanced packaging for Nvidia's product portfolio, including its crucial data center processors.
AdThis expanded partnership underscores the immense pressure on the chip industry to scale its supply chain to meet the explosive growth in AI. Advanced packaging is a key bottleneck in semiconductor manufacturing, and securing domestic capacity is a strategic priority for leading chip designers like Nvidia.
Bolstering the Domestic Supply Chain
The agreement is the latest in a series of strategic moves by Amkor to cement its role in the U.S. semiconductor ecosystem. The company's recent initiatives include:
- A 10-year partnership with contract chipmaking giant TSMC, announced in June, to enhance semiconductor packaging capabilities in the United States.
- Ongoing work with Nvidia competitor Advanced Micro Devices (AMD) to package its chips.
These collaborations highlight a broader industry trend of onshoring more of the complex chip manufacturing and packaging process to strengthen the resilience of the U.S. supply chain for critical technologies.
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