Corewise Shares Gain Over 7% on Strong PCB Equipment Orders and Advanced Packaging Outlook

Shares of Corewise Microelectronics Equipment (09630.HK) gained more than 7% in recent trading, fueled by a strong order backlog for its high-end printed circuit board (PCB) equipment and growing momentum in the advanced semiconductor packaging sector.

Stock Performance

During the session, the company's stock rose as much as 7.69% to trade at HK$383.8. The surge was accompanied by significant investor interest, with a trading turnover of HK$132 million.

Strong Orders and Capacity Expansion

At a recent semi-annual earnings meeting, Corewise Chairman Cheng Zhuo stated that the company has a substantial number of orders on hand, according to a Zhitong Finance report. This demand is primarily driven by the expansion of AI servers and high-speed optical modules.

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Cheng noted that production schedules for the company's high-end PCB products—including HDI, high-multilayer boards, and IC substrates—are full. To meet this demand, Corewise's Phase II production facility is expected to become fully operational in the second half of the year, which will work in tandem with its Phase I base to accelerate order deliveries.

Growth in Advanced Packaging

A recent report from Guojin Securities highlighted that the Phase II facility, which has a design capacity more than double that of Phase I, began ramping up production in the first half of the year. The firm also noted that Corewise has secured long-lead-time core components for its equipment.

Furthermore, Corewise is making significant inroads in the advanced packaging market. The company has delivered its WLP2000 wafer-level direct imaging lithography equipment in batches to a leading domestic outsourced semiconductor assembly and test (OSAT) firm. According to the report, the equipment has passed reliability verification for the client's CoWoS-L (Chip-on-Wafer-on-Substrate-Like) production line, resulting in repeat bulk orders.